چسب سیلیکونی مقاوم در برابر حرارت

Thermal paste (white paste);

Thermal conductivity >0.671W/mk;

The breaking strength is 1.5MPA ;

Surface vulcanization time 10MIN/25 °C   

Scope of application:

High strength,

Fast bonding effect,

Suitable for all kinds of components, LEDs and heat sinks that need to be directly bonded firmly, etc.)  

Packing specification:

5 g / stick,

The package is airtight and the jacket vacuum bag isolates the air and increases the storage time.

Product performance:

It is a one-component room temperature vulcanized silica gel with good thermal conductivity and insulation. It has good conductivity, wide temperature range ( -60~200 °C) and short-term resistance to 300 °C. In addition, it has short surface curing time, strong adhesion, long storage period, non-toxic, solvent-free, and can be safely applied in the elastic bonding, heat dissipation, insulation and packaging of electronics, electrical appliances, instruments, LEDs , heat sinks and other industries.

Instructions:

1. When using, directly extrude the product, rub it with the surface of the adherend, and cover it immediately after use, in case of trial again;

2 , the surface fixed speed is related to the relative humidity and temperature in the air; the higher the temperature, the faster the curing speed, and vice versa;

3 , recommended to apply thickness: 0.1-0.5mm , the thinner the better.

4. Please clean the surface of the bonded object before use (such as alcohol), avoid cleaning with detergent, and apply it after the surface is clean.